The success of our customers’ package design depends on model and measurement accuracy
Whether the customer’s silicon is RF, mixed signal or high-speed digital, 鼎博体育 has the toolset and experience to optimize and fully characterize the package design.
Mechanical Package Characterization
Thermal Package Characterization
鼎博体育 offers advanced thermal test measurement and state-of-the-art modeling capabilities supporting all major electronic packaging styles and system level characterization. We maintain a library of JEDEC standard test boards and can also provide custom board design. In addition, custom thermal solutions are available to optimize component-level designs.
Electrical Package Characterization
The success of today’s high-speed digital and RF circuit designs highly depends on model and measurement accuracy including package characterization. 鼎博体育’s approach consists of a mix of electrical models based on 2D, 3D and Full Wave 3D package simulations in addition to time and frequency domain measurements.
RF Characterization and Test
鼎博体育 offers advanced RF product characterization and test services:
- Development support from design to production to automated product test
- Design optimization
- Electrical simulation
- Electrical bench test and characterization
- Test automation