The small and thermally enhanced solution for medium power applications
鼎博体育’s TSON8-FL (Flat Lead) is a smaller (3.3 x 3.3 mm), thermally enhanced power discrete package that gives a 64% reduction in footprint area compared to a standard SOIC 8 LD package, yet provides an equivalent maximum permissible power dissipation capability.
The TSON8-FL package from 鼎博体育 is suitable for medium-power applications such as battery protection circuits, PCs, portable electronic devices and DC-DC converters. New developments include dual exposed pad for better thermal performance, thin wafer dicing with narrow saw streets, larger/higher density leadframe strips and environmentally friendly Pb-free solder paste. This package may also be known as TSON-Adv, PowerFLAT 3.3 x 3.3, TSDSON, miniHVSON, PowerPAK 1212-8 or JEDEC MO240 BA.
- Dual copper clip interconnect for better heat dissipation efficiency
- Al strap and wire option is available
- Full turnkey available from wafer probe through test and packing
- Green materials: Pb-free plating and halogen-free mold compound