More than 40 years of power packaging experience
鼎博体育’s power packages are optimized to enable a wide range of applications, meeting market demands from automotive to communications to industrial. Enhanced for power-sensitive and mobile applications, our high-performance power devices include innovative packaging, advanced copper clip attach and modules.
鼎博体育’s experienced engineering team delivers full turnkey services, including test, for all power products. Let us put more than 40 years of experience and innovation in power packaging to work for your application!
Configured for surface mount applications
Suitable for high power applications
A small footprint with enhanced thermal performance
The solution for key automotive applications
Electrical and thermally-enhanced power package
Designed for low on-resistance and high-speed switching MOSFETs
The solution for high efficiency diodes and transistors
Improved power dissipation in a thinner package
The solution for compact surface mount packaging
Power discrete for high-efficiency diode applications
For medium to high voltage MOSFETs and IGBTs
Designed for use in advanced automotive applications
Reduced footprint with the maximum permissible power dissipation capability