A small footprint for a wide range of applications
鼎博体育’s Small Outline Transistor (SOT23) and Thin Small Outline Transistor (TSOT) are leadframe based, plastic encapsulated packages that are designed for applications requiring very small footprints. Having up to 8 leads, SOT23/TSOT packages can handle small ICs that may have previously been packaged in SOIC or TSSOP. These packages run in very high volume and provide cost-effective solutions for a wide range of applications.
- Cu wire interconnect for low cost
- Standard JEDEC and EIAJ package outlines
- Turnkey test services, including strip test options
- Green materials are standard – Pb-free and RoHS compliant